Its core components consist of a nanosecond/picosecond laser etching system, precision motion platform, CCD vision positioning system, PC control system, dust and fume extraction system, cooling system, etc.
Model No.: Non-standard customization
Laser power: 15W-100W(optional)
Laser wavelength: 355nm
Processing type: Laser Etching
Cooling method: Water cooling
Platform Speed: 0.1-1000mm/s
A circuit substrate laser etching machine is an automated device that uses a high-energy laser beam for non-contact precision etching of conductive layers, metal films, or coatings on circuit substrates. The laser is focused on the substrate surface through an optical system, causing local vaporization or photochemical decomposition of the material to form fine circuits, isolation grooves, windows, and complex patterns. Compared with traditional chemical etching and mechanical processing, it offers advantages such as no mask required, no chemical liquid pollution, no mechanical stress, high precision, a small heat-affected zone, and high flexibility. It is especially suitable for precision etching of FPCB, PCB, rigid-flex boards, ceramic substrates, glass, metal films, and other materials.

Its core components consist of a galvanometer scanning laser cutting system, precision motion platform, CCD vision positioning system, PC control system, dust and fume extraction system, cooling system, etc.

Marble structure, providing a foundation for high precision and high stability;
Linear motor + guide rail + linear encoder, full closed-loop control, achieving high speed and high precision simultaneously with no wear and long service life;
Fully sealed design for the laser and external optical path, preventing dust ingress, extending lens service life, and reducing maintenance frequency;
The software supports optional automatic laser power detection and automatic compensation. It can be combined with hardware to achieve automatic detection and automatic compensation correction of laser power, so as to minimize and eliminate the impact of laser head power attenuation (optional);
Excellent self-developed software, fully integrating various lasers, motion, control, and know-how.

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