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The equipment consists of a Laser, optical focusing system, galvanometer scanning system, precision motion platform, CCD vision positioning system, PLC/PC control system, dust and fume extraction system, cooling system, etc.
Model No.: Non-standard customization
Laser power: 15W-60W（optional）
Laser wavelength: 315nm/532nm
Processing type: Laser Drilling
Cooling method: Water cooling
Platform Speed: 0.1-1000mm/s
An FPCB laser drilling machine is an automated device that uses a high-energy laser beam for non-contact precision micro-hole processing of non-metallic materials. By focusing the laser on the surface of circuit substrate materials, the material is locally melted, vaporized, or subjected to photochemical decomposition, thereby forming micro-holes. Compared with traditional mechanical drilling, it offers advantages such as no tool wear, no mechanical stress, less prone to edge chipping, and greater friendliness to brittle materials. It is especially suitable for precision processing of non-metallic materials such as glass, ceramics, sapphire, PCB/FPC, plastics, and composite materials.
Laser, optical focusing system, galvanometer scanning system, precision motion platform, CCD vision positioning system, PLC/PC control system, dust and fume extraction system, cooling system, etc.
Non-contact processing, no mechanical stress, avoiding material cracking and chipping;
Small hole diameter and high precision, enabling micron-level micro-hole processing;
Small heat-affected zone, suitable for thin, brittle, and heat-sensitive materials;
Supports round holes, irregular holes, array holes, blind holes, through holes, and other hole types;
Equipped with CCD vision positioning for automatic alignment and deviation compensation;
Can be equipped with UV lasers, picosecond/femtosecond lasers, etc., selected according to the material;
High degree of automation, supporting standalone operation or production line integration.
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