Laser Marking Machine for IC Substrates

For IC substrate finished strips, laser automatic marking and labeling is performed. The laser marking offers high precision and high legibility, effectively avoiding the problems of manual marking such as poor consistency, susceptibility to errors and omissions, poor fineness, and low legibility, thereby facilitating efficient and accurate identification in subsequent processes. It can achieve semi-automatic or fully automatic processing. The production process includes: automatic loading, board picking, positioning, marking, recognition, station switching, unloading, and other procedures. No manual operation is required. It can operate inline with SMT production lines or form an offline workstation with an automatic loader/unloader.

It offers advantages such as no consumables, non-contact processing, no mechanical stress, high precision, strong weather resistance, and clear and durable marking. It is especially suitable for precision marking and traceability management of IC substrates, packaging substrates, ceramic substrates, FPCB, and other materials.

Equipment Features:

• Non-contact processing, no mechanical stress, no damage to the substrate;

• High marking precision, clear characters, high contrast, and permanent preservation;

• Small heat-affected zone, suitable for thin, brittle, and high-density substrates;

• Supports QR codes, barcodes, characters, lot numbers, traceability codes, etc.;

• Equipped with CCD vision positioning for automatic alignment and deviation compensation;

• Optional UV, green, fiber, picosecond, and other lasers, selected according to the material;

• Supports automatic loading/unloading and roll-to-roll/sheet-to-sheet production;

• Can be integrated with MES systems for production data traceability and intelligent management;

• Dust and fume extraction system, safe and environmentally friendly.

Technical Specifications