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Adopting non-contact laser engraving, the machine can mark barcodes, QR codes, characters and other information on the surface of copper clad laminate (CCL) substrates to realize full-process intelligent product traceability.
Model No.: Non-standard customization
Laser power: 15W-100W（optional）
Laser wavelength: 355nm/532nm
Processing type: Laser marking
Cooling method: Water cooling
Platform Speed: 0.1-1000mm/s
Adopting non-contact laser engraving, the machine can mark barcodes, QR codes, characters and other information on the surface of copper clad laminate (CCL) substrates to realize full-process intelligent product traceability. It is specially developed for copper foil substrates, prepregs, IC carrier substrates and PCB mother boards. It completes the full workflow in one stop: automatic loading → visual positioning → double-sided marking → code reading & verification → automatic unloading.
It addresses pain points of traditional processes: large positioning error caused by manual flipping, inkjet marks easy to wipe off, thin substrate damage during flipping, and mismatch between codes on front and reverse sides. It meets traceability and coding requirements for CCL manufacturers, high-speed carriers and optical module substrates. It supports offline standalone operation and online connection with SMT production lines, compatible with SMEMA standard interface. MES data upload is enabled to achieve full-lifecycle substrate traceability.
Double-sided marking for CCL: Load once, automatically flip the board, and finish laser marking on both sides. Non-contact laser processing without mechanical compression reduces risks of thin substrate bending and copper foil scratching.
UV / picosecond cold laser options are available, featuring minimal heat-affected zone to prevent yellowing and carbonization of CCL substrates and guarantee substrate electrical performance. Automatic code reading and verification after marking identifies defective codes and prevents mismatched codes between front and reverse sides.
1. Supports automatic loading, unloading and board flipping. Laser marking on both sides of CCL is completed with one-time loading to reduce manual intervention.
2. High-resolution camera positioning; X/Y axis positioning accuracy ±5μm, suitable for marking tiny QR codes and fine characters.
3. Optional 355nm / 532nm, nanosecond / picosecond lasers. Cold processing brings low thermal impact to protect thin substrates and copper foil.
4. Non-contact laser engraving; marks resist scrubbing and subsequent manufacturing processes for long-term substrate traceability.
5. Optional automatic code reading & grading function, data connection with MES/ERP system for defective code identification.
6. Linear motor drive, self-developed focusing and software system, supports DXF file import for flexible product changeover.
7. Available for standalone use or integration into automatic production lines, compatible with CCL, IC carrier boards, PCB substrates and various other base materials.
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