Dual-station laser solder ball welding machine (VIL-LWB-CS2) adopts a fiber laser and marble mechanical structure, highly integrated with the industrial control system inside the machine cabinet. Equipped with a precision automatic solder ball dispensing mechanism, it enables synchronous solder ball placement and laser welding.
Precision Microball Laser Bumping Machine (VIL-LWMB-CS2) is a micron-level non-contact laser solder ball jetting and placement machine. It features precise positioning, rapid soldering, stable quality, low thermal stress, and no-clean processing.
The welding system of the equipment is composed of laser plus tin ball splitting mechanism, and the motion control system is composed of left and right double-station interactive feeding system by servo screw module, motion control card, industrial computer, visual positioning and special upper computer software.
This equipment is a single-station operation machine with a more compact appearance. It is mainly composed of a high-speed linear motor module, a marble base, an automatic solder ball jetting system, a vision positioning system, a nitrogen protection system, post-soldering inspection, and a computer software control system.
Dual-station laser solder ball welding machine (VIL-LWB-CS2) adopts a fiber laser and marble mechanical structure, highly integrated with the industrial control system inside the machine cabinet. Equipped with a precision automatic solder ball dispensing mechanism, it enables synchronous solder ball placement and laser welding.
Precision Microball Laser Bumping Machine (VIL-LWMB-CS2) is a micron-level non-contact laser solder ball jetting and placement machine. It features precise positioning, rapid soldering, stable quality, low thermal stress, and no-clean processing.
The welding system of the equipment is composed of laser plus tin ball splitting mechanism, and the motion control system is composed of left and right double-station interactive feeding system by servo screw module, motion control card, industrial computer, visual positioning and special upper computer software.
This equipment is a single-station operation machine with a more compact appearance. It is mainly composed of a high-speed linear motor module, a marble base, an automatic solder ball jetting system, a vision positioning system, a nitrogen protection system, post-soldering inspection, and a computer software control system.
Dual-station laser solder ball welding machine (VIL-LWB-CS2) adopts a fiber laser and marble mechanical structure, highly integrated with the industrial control system inside the machine cabinet. Equipped with a precision automatic solder ball dispensing mechanism, it enables synchronous solder ball placement and laser welding.
Precision Microball Laser Bumping Machine (VIL-LWMB-CS2) is a micron-level non-contact laser solder ball jetting and placement machine. It features precise positioning, rapid soldering, stable quality, low thermal stress, and no-clean processing.
The welding system of the equipment is composed of laser plus tin ball splitting mechanism, and the motion control system is composed of left and right double-station interactive feeding system by servo screw module, motion control card, industrial computer, visual positioning and special upper computer software.
This equipment is a single-station operation machine with a more compact appearance. It is mainly composed of a high-speed linear motor module, a marble base, an automatic solder ball jetting system, a vision positioning system, a nitrogen protection system, post-soldering inspection, and a computer software control system.
The main scope includes laser welding applications inthe fields of 10G, 25G, 40G, 100G, 400G opticaldevices, tosa coaxial FCPC and PCBA, and integratedoptical modules.
Mainly used for efficient and precise ball placementsoldering of miniaturized products such as hard diskheads, BGA chips, wafers, transistors, etc.
The scope of application includes but is not limited to laser soldering applications in the automotive electronics field, such as circuit boards and wire harness terminals, sensors, IGBT modules, etc.
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