Precision Laser Cutting Machine

VI LASER Laser Cutting Machine is an automated device for non-contact precision cutting of substrates in the electronics industry. It offers two laser options: nanosecond and picosecond. Its core components consist of a galvanometer scanning laser cutting system, precision motion platform, CCD vision positioning system, PC control system, dust and fume extraction system, cooling system, etc. Compared with traditional mechanical punching, die cutting, and milling, it offers advantages such as no tool wear, no mechanical stress, less edge chipping, high precision, a small heat-affected zone, and greater friendliness to thin and brittle materials. It is especially suitable for precision processing of FPC/FPCB, coverlay, stiffeners, electromagnetic shielding films, and other materials.

Equipment Features:

1. Marble structure, providing a foundation for high precision and high stability;

2. Linear motor + guide rail + linear encoder, full closed-loop control, achieving high speed and high precision simultaneously with no wear and long service life;

3. Fully sealed design for the laser and external optical path, preventing dust ingress, extending lens service life, and reducing maintenance frequency;

4. The software supports optional automatic laser power detection and automatic compensation. It can be combined with hardware to achieve automatic detection and automatic compensation correction of laser power, so as to minimize and eliminate the impact of laser head power attenuation (optional);

5. Excellent self-developed software, fully integrating various lasers, motion, control, and know-how;

6. On the basis of manual loading/unloading equipment, an automatic loading/unloading mechanism can be added to achieve automated production without manual intervention (optional).

Technical Advantages:

1. Precision control: Both adopt linear motor platforms (positioning accuracy ±1–3 μm) and CCD vision positioning to ensure micron-level processing.

2. Damage-free processing: The cut cross-section has no discoloration and no protrusion; vertical cutting has no chamfer, making post-cut depaneling easier.

3. Wide applicability: Ceramic substrates: alumina, aluminum nitride, HTCC/LTCC, etc., used for LED and semiconductor packaging. FPCB substrates: flexible circuit boards, rigid-flex boards, coverlay window opening.

4. Automation and intelligence: Supports automatic loading/unloading, vision alignment, remote monitoring, and production data management to improve efficiency.