The enameled wire laser stripping and soldering all-in-one machine integrates a precision laser enamel stripping unit and a laser soldering unit, completing the entire process of enameled wire insulation film stripping, cleaning, and solder forming in one station.
Model No.: Non-standard customization
Laser power: 10-500W (Optional）
Laser wavelength: 915nm / 976nm / 1064nm (Optional）
Soldering method: Solder wire, Solder ball (Optional）
Cooling method: Full air cooling/Water cooling
Machining accuracy: ≥0.05mm
The enameled wire laser stripping and soldering all-in-one machine integrates a precision laser enamel stripping unit and a laser soldering unit, completing the entire process of enameled wire insulation film stripping, cleaning, and solder forming in one station. It replaces traditional mechanical scraping, chemical paint removal, and manual soldering processes.
The equipment adopts a dual-optical-path design (UV pulsed laser for enamel stripping and semiconductor laser for soldering), combined with coaxial CCD vision positioning, infrared closed-loop temperature control, an automatic solder wire feeding system, and a servo motion platform. With non-contact processing, it solves pain points such as scratching and wire breakage of ultra-fine enameled wires, difficulty in tinning aluminum enameled wires, thermal deformation of coil bobbins, and poor solder joint consistency. It is suitable for mass production of precision components such as copper/aluminum enameled wire coils, micro motors, inductors, and transformers, and can be used as a standalone machine or integrated into automated production lines.
Laser Enamel Stripping: The UV pulsed laser is focused to a micron-scale spot, instantly vaporizing the insulation enamel film on the surface of the enameled wire. Only the enamel layer in the specified area is removed, with almost no damage to the copper/aluminum conductor. The stripping length and number of stripping turns can be set, and both local fixed-point stripping and circumferential stripping are supported, with no mechanical cutting stress.
Laser Soldering: After enamel stripping is completed, coaxial CCD performs secondary positioning, and the semiconductor laser locally heats the solder wire. The solder melts and wets the bare wire conductor and the PCB/terminal pads. Infrared temperature measurement collects the solder joint temperature in real time and dynamically adjusts the laser power, strictly controlling heat input to avoid thermal damage to coil bobbins, magnetic cores, and FPCs.
Process flow: workpiece fixture positioning → CCD vision image capture and deviation correction → laser enamel stripping → fume/dust blow-off cleaning → automatic solder wire feeding → laser soldering → solder joint AOI inspection (optional) → unloading
The same machine sequentially completes enamel stripping and soldering, eliminating a separate paint removal station and reducing secondary clamping and positioning errors of the product;
Non-contact processing enables damage-free, clean stripping of ultra-fine wires of 0.05 mm and above, effectively improving the pain point of difficult tinning of aluminum wires;
Coil windings and bobbins, magnetic cores, and plastic parts are not easily deformed, and coil inductance parameters remain stable;
Precisely controls stripping length, width, and number of stripping turns, supports local fixed-point stripping, and eliminates the need to strip the entire segment;
Stripping fume/dust recovery function, environmentally friendly and consumable-free.
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