PCB And Wire Automated Laser Soldering Equipment
PCB And Wire Automated Laser Soldering Equipment
Equipment Features

It consists of a high-precision X, Y, Z motion positioning system, automatic solder wire feeding and breaking system, robotic arm laser soldering system, CCD vision positioning system, product transfer fixture positioning system, fixture return circulation system, real-time soldering monitoring and control system, temperature feedback control system, wire sequence detection system, etc.

Model No.: VS283C

Laser power: 200W

Laser wavelength: 915nm

Soldering method: Solder wire welding

Cooling method: Water cooling

Solder wire diameterr: 0.5-2.0mm

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Description
Equipment Applications/Case

PCB And Wire Automated Laser Soldering Equipment

The equipment model is VS283C. It is specially developed for precision interconnection soldering between PCB circuit boards and electronic wires. It is an inline assembly line soldering equipment designed to be embedded into the customer’s complete production line to assist in completing the soldering production stage. The machine dimensions are 3000 (L) × 1100 (W) × 2000 (H) mm. It consists of a high-precision X, Y, Z motion positioning system, automatic solder wire feeding and breaking system, robotic arm laser soldering system, CCD vision positioning system, product transfer fixture positioning system, fixture return circulation system, real-time soldering monitoring and control system, temperature feedback control system, wire sequence detection system, etc. It is also an efficient and rapid automated device for soldering circuit boards and electronic wires. Its high-quality and reliable automatic laser soldering solution can help enterprises effectively save labor and production costs.

三工位自动激光焊锡机2

Technical specifications

  • Motion: XYZ 3-axis manipulator
  • Repeat Positioning Accuracy: ±0.02 mm
  • Laser Source: Semiconductor laser
  • Cooling: Water cooling
  • Solder Material: Solder wire
  • Power Supply: AC220V 50Hz
  • Control: PC + PLC
  • Device dimensions: 3000 (L) × 1100 (W) × 2000 (H) mm

Equipment Advantages:

  1. Adopts non-contact soldering, with no mechanical stress damage and minimal thermal effect;

  2. Three-axis robotic arm intelligent control system (customization optional), capable of handling precision soldering processes at various complex angles;

  3. Coaxial CCD camera positioning and processing monitoring system, which can clearly present solder joints and promptly correct alignment, ensuring processing precision and automated production;

  4. Laser, CCD, temperature control, and indicator light are four-point coaxial, perfectly solving the industry’s multi-optical-path coincidence challenge and avoiding complex debugging;

  5. Product transfer fixture positioning + fixture return circulation system, achieving fine positioning and soldering tracking while eliminating manual unloading operations, enabling one machine to be operated by one operator and saving enterprise labor costs;

  6. While ensuring a pass rate of 99%, the minimum solder joint diameter is 0.2 mm, and the soldering time per solder joint is shorter.

三工位自动激光焊锡机3

Application
Soldering of electronic wires / enameled wires to PCB and FPC pads
Pcba电子线焊接
通孔线材焊接
PCB Power Cable Soldering

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