Fully Automatic Laser Soldering Machine
Fully Automatic Laser Soldering Machine
Equipment Features

The fully automatic laser soldering machine features a multi-station assembly line design and adopts a high-precision manipulator, CCD vision positioning, and temperature control. It has a small heat-affected zone, a repeat positioning accuracy of ±0.02 mm, and optional soldering methods such as solder wire, solder paste, solder balls, and solder rings.

Model No.: Non-standard customization

Laser power: 50-500W (Optional)

Laser wavelength: 915nm / 976nm / 1064nm (Optional)

Soldering method: Solder wire, paste, ball, and ring welding (Optional)

Cooling method: Full air cooling/Water cooling

Welding precision: ≥0.05mm

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Description
Equipment Applications/Case

Fully Automatic Laser Soldering Machine

The fully automatic laser soldering machine features a multi-station assembly line design and adopts a high-precision manipulator, CCD vision positioning, and temperature control. It has a small heat-affected zone, a repeat positioning accuracy of ±0.02 mm, and optional soldering methods such as solder wire, solder paste, solder balls, and solder rings. The minimum solder joint diameter is 0.2 mm. It integrates an AOI post-soldering inspection system, which can provide real-time feedback on soldering quality and quickly screen out nonconforming products. It is widely suitable for precision soldering scenarios such as 3C electronics and automotive electronics.

金属焊接机

Equipment Functions:

  1. Semiconductor Laser Soldering System: It adopts an infrared semiconductor laser module, with optional laser power. It uses a high-precision temperature feedback control system. Through precise temperature control, the soldering effect can be fully ensured and damage to the soldered workpieces can be avoided.

  2. Assembly Line and Automatic Loading/Unloading System: It adopts a gantry-type automatic loading/unloading system with automatic vision alignment, making it especially suitable for applications requiring assembly, alignment, and soldering. For fixture return, it adopts Zichen’s original design in which fixed parts and movable parts are separated along the line, enabling unmanned operation throughout the process. The ring-shaped assembly line uses imported components, providing high positioning accuracy, stability, and reliability.

  3. Rich Modular Combinations: The entire system adopts a modular design. According to customer requirements, it can be equipped with Zichen Laser’s self-developed laser solder paste, laser solder wire, and laser solder ball soldering systems.

Purchase Information:

  1. Zichen Laser is responsible for providing free installation and commissioning of the equipment purchased by the customer, as well as training the customer’s technical personnel.

  2. Zichen Laser’s service network covers both domestic and overseas markets. Any customer issue will receive a response within 12 hours. In emergency cases, we will arrive at the customer site within 24 hours.

  3. The equipment comes with a one-year warranty and lifetime maintenance service, providing customers with excellent products, superior quality, and one-stop service.

Application
It is mainly used for FPC flexible boards, flexible flat cables, and optical communication modules, such as automatic loading/unloading, automatic alignment, and automatic solder paste dispensing laser soldering for FPC-to-TOSA, FPC-to-ROSA, and FPC-to-PCB in 100G products. It can also be extended to other application scenarios requiring automatic loading/unloading and automatic assembly alignment.

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