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This equipment is a single-station operation machine with a more compact appearance. It is mainly composed of a high-speed linear motor module, a marble base (or a standard cabinet base as an alternative), an automatic solder ball jetting system, a vision positioning system, a nitrogen protection system, post-soldering inspection, and a computer software control system. It can be customized according to customer requirements.
Model No.: VIL-LWB-CS1
Laser power: 50-200W（optional)
Laser wavelength: 1064nm
Process method: Solder ball bonding
Cooling method: Full air cooling
Spray ball diameter: 50μm~2000μm
This equipment is a single-station operation machine with a more compact appearance. It is mainly composed of a high-speed linear motor module, a marble base (or a standard cabinet base as an alternative), an automatic solder ball jetting system, a vision positioning system, a nitrogen protection system, post-soldering inspection, and a computer software control system. It can be customized according to customer requirements.
It is fully enclosed integrated design meets-ergenomic and safety protection standards，and suitable for microelectronics soldering such as semiconductor wafers, BGA chips, 5G optical communication modules, sensors, mobile phones and security camera modules.
The machine is equipped with VILASER’s self-developed semiconductor laser soldering system, supporting optional dual wavelengths of 915/976 nm. Combined with a high-precision constant-speed solder wire feeding mechanism and an intelligent AOI vision algorithm.
This machine adopts a lightweight closed-loop design, offering high cost-effectiveness and easy mobility. It is equipped with a semiconductor laser soldering system, solder wire feeding mechanism, CCD positioning system, motion mechanism, dual Y-axis worktable, etc.
VI LASER’s standardized equipment adopts a dual-station feeding operation mode. Two fixtures alternately reciprocate into the soldering area of the worktable, saving loading time and improving production efficiency. Operators only need to load and unload the fixtures, ensuring smooth continuous operation, and production efficiency can be increased by more than 40%.
VI LASER desktop soldering machine adopts a dual-station reciprocating feeding operation mode, ensuring smooth continuous operation. Two fixtures alternately reciprocate into the soldering area inside the worktable, enabling a simultaneous process of automatic solder wire feeding and laser soldering.
This model adopts an independent dual-gantry + dual-station alternating operation architecture, thoroughly addressing the pain points of traditional single-station systems such as “waiting for solder paste dispensing, waiting for soldering, and downtime for loading/unloading,” ensuring smooth continuous operation.
The equipment adopts a rotary four-station operation mode, enabling the entire process of automatic solder paste dispensing and automatic laser soldering. Four fixtures rotate alternately into the soldering area inside the worktable, increasing production efficiency by more than 20% compared with a reciprocating dual-station system.
The welding system of the equipment is composed of laser plus tin ball splitting mechanism, and the motion control system is composed of left and right double-station interactive feeding system by servo screw module, motion control card, industrial computer, visual positioning and special upper computer software.
Precision Microball Laser Bumping Machine (VIL-LWMB-CS2) is a micron-level non-contact laser solder ball jetting and placement machine. It features precise positioning, rapid soldering, stable quality, low thermal stress, and no-clean processing.
Dual-station laser solder ball welding machine (VIL-LWB-CS2) adopts a fiber laser and marble mechanical structure, highly integrated with the industrial control system inside the machine cabinet. Equipped with a precision automatic solder ball dispensing mechanism, it enables synchronous solder ball placement and laser welding.