VSC1601 High-Precision Laser Solder Wire Soldering Machine

The high-precision VSC1601 laser soldering machine adopts an independent dual-gantry + dual-station alternating operation architecture, thoroughly eliminating the pain points of traditional single-station laser soldering, such as “soldering waiting, loading/unloading downtime, low manual re-inspection efficiency, and uncontrollable solder joint quality.” It achieves full-process operation from loading, positioning, automatic solder wire feeding, laser soldering, real-time AOI inspection, to good-product determination, balancing high efficiency and precision soldering quality. It is a core workhorse machine for the current automated upgrade of precision electronic assembly.

The machine is equipped with VILASER’s self-developed semiconductor laser soldering system, supporting optional dual wavelengths of 915/976 nm. Combined with a high-precision constant-speed solder wire feeding mechanism and an intelligent AOI vision algorithm, it can automatically identify defects such as cold solder joints, missed soldering, insufficient solder, solder bridging, and offset, truly realizing integrated closed-loop production of soldering + inspection. It is specially designed for mass production scenarios with high density and high consistency requirements, such as 3C electronics, automotive electronics, and precision connectors.

Core Equipment Structure

1. Dual-Gantry High-Speed Motion Architecture
   It adopts a split-type independent dual-gantry servo motion system, ensuring smooth operation and extremely high repeat positioning accuracy. The two gantries do not interfere with each other and are independently driven, enabling simultaneous soldering tasks at different stations. It supports multi-point array, irregular trajectory, and multi-pin continuous soldering.

2. Dual-Station Alternating Operation Mode
   The left and right dual stations work in alternating cycles. While station A is soldering, station B can simultaneously complete manual loading/unloading, greatly reducing waiting time. The equipment utilization rate is nearly full load, and production capacity is increased by more than 80% compared with single-station equipment, perfectly matching the pace of large-scale assembly line mass production.

3. Laser Solder Wire Precision Soldering System
   It is equipped with a semiconductor laser and closed-loop PID real-time temperature control technology, enabling localized low-temperature fixed-point solder melting with minimal thermal effect. The high-precision constant-speed solder wire feeding module is compatible with ultra-fine solder wire, providing uniform solder feeding and clean wire cutting, eliminating solder piling and cold solder joints.

4. Post-Soldering AOI Visual Inspection System
   It integrates a dedicated soldering AOI visual inspection module. A high-definition industrial camera combined with a self-developed image algorithm immediately and automatically captures images for analysis after soldering is completed. It intelligently identifies defects such as cold solder joints, missed soldering, solder bridging, insufficient solder, excess solder, solder joint offset, and excessive solder spikes. It automatically records data and classifies good/defective products, replacing manual visual inspection with high inspection accuracy and strong consistency.