The application advantages of laser soldering technology in the development of modern electronic welding technology

With the rapid development of modern electronic information technology, integrated circuit chip packaging forms are constantly emerging, and packaging density is increasing, greatly promoting the development of electronic products towards multifunctionality, high performance, high reliability, and low cost. So far, through-hole technology (THT) and surface mount technology (SMT) are very common in the electronic assembly manufacturing industry. They have been widely used in PCBA technology and have their own advantages or technical fields.

With the increasing density of electronic components, some through-hole inserts can no longer be soldered using traditional wave soldering. The emergence of selective laser soldering technology seems to be a special form of selective brazing technology developed to meet the development requirements of through-hole component soldering. Its process can be used as a substitute for wave soldering, which can optimize the process parameters of each solder joint to achieve the best soldering quality.

Evolution of Welding Process for Through Hole Components

In the development process of modern electronic welding technology, it has undergone two historic changes:

The first time was the transition from through-hole welding technology to surface mount welding technology; The second time is the transition we are experiencing from lead based soldering technology to lead-free soldering technology.

The evolution of welding technology has directly brought two results:

Firstly, the number of through-hole components that need to be soldered on circuit boards is decreasing; Secondly, the soldering difficulty of through-hole components (especially those with large heat capacity or fine pitch) is increasing, especially for products that require lead-free and high reliability.

Let's take a look at the new challenges facing the global electronic assembly industry:

Global competition forces manufacturers to bring their products to market in a shorter period of time to meet the constantly changing demands of customers; The seasonal changes in product demand require flexible production and manufacturing concepts; Global competition forces manufacturers to reduce operating costs while improving quality; Lead free production is the trend. The above challenges are naturally reflected in the selection of production methods and equipment, which is also the main reason why selective laser soldering has developed faster than other welding methods in recent years; Of course, the arrival of the lead-free era is another important factor driving its development.

Laser soldering machine is one of the process equipment used in the manufacturing of various electronic components, which involves soldering specific electronic components onto a printed circuit board without affecting other areas of the circuit board, usually involving the circuit board. It is generally completed through three processes: wetting, diffusion, and metallurgy. The solder gradually diffuses towards the pad metal on the circuit board, forming an alloy layer on the contact surface between the solder and the pad metal, making the two firmly bonded. Through the device programming device, selective welding is sequentially completed for each solder joint.

The advantages of laser soldering machine in electronic manufacturing

1. Non contact processing, stress free, and pollution-free;
2. Laser soldering has high quality and consistency, with full solder joints and residual Wuxi beads;
3. Laser soldering can facilitate automation;
4. The equipment has low energy consumption, energy conservation and environmental protection, low consumable costs, and low maintenance costs;
5. Compatible with both large and precision solder pads, with the smallest pad size reaching up to 60um, making it easy to achieve precision soldering;
6. The process is simple, completed in one soldering step, without the need for spraying/printing flux or subsequent cleaning procedures.