Precision Laser Solder Ball Welding System by Zichen Laser
Precision Laser Solder Ball Welding System by Zichen Laser
As a leading manufacturer of laser soldering solutions, Zichen Laser introduces its advanced Laser Solder Ball Welding Machine, engineered for ultra-precise, high-reliability soldering in microelectronics and advanced packaging.
Key Features :
- Non-Contact Laser Technology : Ensures contamination-free bonding with minimal thermal impact, ideal for heat-sensitive components.
- Micro Solder Ball Jetting : Accurately deposits solder balls as small as 60–300 μm, perfect for BGA (Ball Grid Array), CSP (Chip-Scale Package), and MEMS applications.
- High-Speed Automation : Achieves up to 2,000 welds/hour with closed-loop vision alignment for zero-defect production.
- Adaptive Process Control : Adjusts power, temperature, and pulse duration in real-time for diverse materials (SnAgCu, SnPb, etc.).
Applications:
- Advanced Electronics : Semiconductor packaging, 5G modules, and miniaturized PCB assemblies.
- Automotive & Medical : High-reliability soldering for sensors, EV power systems, and implantable devices.
- Research & Prototyping : Repeatable precision for R&D labs and low-volume production.
Why Choose Zichen?
- ISO-Certified Quality : Built to meet IPC-A-610 and J-STD-001 standards.
- 24/7 Technical Support : Global service network for seamless integration.
- Customizable Solutions : Tailored configurations for unique production needs.
Elevate your microjoining processes with Zichen’s cutting-edge laser solder ball welding technology. Contact us for a demo or quote today!
**Zichen Laser**
Email: zengdongliang@vilaser.cn | Website: www.vilaser.cn
