High precision laser solder ball welding machine (VIL-LWB-CS2)
◆ High efficiency, double station design, save manual loading and unloading time, efficiency increase more than 35%;
◆ Good effect, laser soldering effect is uniform;
◆ Micro processing, the minimum diameter of the tin ball can be 70um;
◆ Function rich, tin ball diameter 70um~2000um optional;
◆ Wide applicability, suitable for all kinds of plane, three-dimensional shaped products precision welding.
▍Product Introduction
Laser solder ball welding machine (VIL-LWB-CS2) adopt fiber lasers, which are highly integrated with the industrial control system in the workbench cabinet. Combine with the ball mounting mechanism to achieve the synchronization of solder ball placement and laser welding. Equipped with a dual-station interactive feeding system, the loading, unloading, automatic positioning and welding can be carried out simultaneously. The diameter of the solder balls that can be sprayed is above 200μm, realizing efficient automatic welding.
▍Product Parameters
| Model No. | VIL-LWB-CS2 |
| Laser power | 100-200W（optional) |
| Laser wavelength | 1064nm |
| Cooling method | Full air cooling |
| Spray ball diameter | 200μm~760μm |
| Motion control | PC+motion control card |
| Positioning accuracy | CCD positioning |
| Motion accuracy | ±5mm |
| Number of stations | 2 stations |
| Welding range | 200*200mm |
| Ball planting efficiency | ≥3 balls /S |
| Nozzle counterpoint | Automatic calibration |
| Power source | AC220V 50Hz |
| Usage Environment | 22-30°C 20-70%（non-condensating） |
| Weight | 1150Kg |
| External dimensions | About 1050(L)*1380(W)*1700(H)mm |
▍Application
It can be used for wafer, BGA chip ball planting, optical communication device packaging, sensor device packaging, MEMS, HDD (HGA, HSA), mobile phone camera module and other high precision device welding.
