Laser solder ball welding machine，Laser ball planting system
◆ High efficiency, double station design, save manual loading and unloading time, efficiency increase more than 35%;
◆ Good effect, laser soldering effect is uniform;
◆ Micro processing, the minimum diameter of the tin ball can be 70um;
◆ Function rich, tin ball diameter 70um~2000um optional;
◆ Wide applicability, suitable for all kinds of plane, three-dimensional shaped products precision welding.
▍Product Introduction
This equipment realizes non-contact solder ball jet welding with a tiny pitch. It features precise positioning, fast welding, stable quality, low thermal stress and being free from cleaning. It is mainly applied in occasions where there are high requirements for temperature sensitivity, precision, efficiency and cleanliness, such as the welding of high-precision components like wafers, optoelectronic products, product sensors, BGAs, HDDs (HGAs, HSAs), mobile phones, digital cameras and camera modules.
▍Product Parameters
| Model No. | VIL-LWMB-CS2 |
| Laser power | 50-100W（optional) |
| Laser wavelength | 1064nm |
| Cooling method | Full air cooling |
| Spray ball diameter | 70μm~200μm |
| Motion control | PC+motion control card |
| Positioning accuracy | CCD positioning |
| Motion accuracy | ±3mm |
| Number of stations | 2 stations |
| Welding range | 200*200mm |
| Ball planting efficiency | ≥3 balls /S |
| Nozzle counterpoint | Automatic calibration |
| Power source | AC220V 50Hz |
| Usage Environment | 22-30°C 20-70%（non-condensating） |
| Weight | 1200Kg |
| External dimensions | 1035(L)*1245(W)*1680(H)mm |
▍Application
It can be used for wafer, BGA chip ball planting, optical communication device packaging, sensor device packaging, MEMS, HDD (HGA, HSA), mobile phone camera module and other high precision device welding.
